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For Harsher Plasma and Higher Sealing Loads

For Harsher Plasma and Higher Sealing Loads

For Harsher Plasma and Higher Sealing Loads

Product ID: Puruz P510

Puruz P510 is a specific compound which is designed for use in wide variety of semiconductor dry-etch processing applications with high sealing loads under harsh plasma environment. This product exhibits excellent performance in oxygen and fluorine-based plasmas. Puruz P510 is formulated in high sealing load applications and remains stable at service temperatures as high as 230°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P510.



  • Slit valve doors
  • Gas inlet seals
  • Window seals
  • KF fitting seals
  • Gas feed-through seals
  • Chamber seals
  • Isolator valve seals
  • Lid seals


Recommended Processes

  • Deposition: CVD, PECVD, HDPCVD...,PVD
  • Plasma etching: Oxide, Metal, Poly
  • Ashing
  • Ion implant
  • Remote plasma cleans
  • Rapid thermal process
  • Excellent plasma resistance
  • Excellent chemical resistance
  • Excellent physical properties
  • Low out-gassing
Typical Physical Properties1
Physical Typical Value
Color White
Hardness, Shore A2 87
Tensile Strength, MPa 12.6
Elongation, % 118
100% Modulus, MPa 10.9
Compression Set4:
70 hours @ 200°C @ 25% Deflection

Service Temperature Range -20°C~230°C
1 Accumulated Average data.
2 ASTM D2240 (AS 568A 214 O-ring test specimens)
3 ASTM D412 (Dumbbell test specimens)
4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application
Contact Detail
Address:No. 41, Wu-Chuan-Wu Road, New Taipei Industrial Park, New Taipei City 24888, Taiwan