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Minimal Particulation in Plasma Process

Minimal Particulation in Plasma Process

Minimal Particulation in Plasma Process

Product ID: Puruz P305 perfluoroelastomer parts

Puruz P305 is an ultra-pure compound offering excellent chemical/physical properties developed for select semiconductor plasma and gas deposition processes. It boasts very low particle generation in oxygen and fluorine containing plasmas versus mineral-filled compounds. Well suited for both static and dynamic applications (such as slit valve door, gas feed-through, chamber lid, etc.), Puruz P305 also remains stable at service temperatures as high as 200°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P305.


  • Slit valve doors
  • Gas inlet seals
  • Window seals
  • KF fitting seals
  • Gas feed-through seals
  • Chamber seals
  • Isolator valve seals
  • Lid seals


Recommended Processes
  • Deposition: CVD, APCVD, HDPCVD..., PVD
  • Plasma etching: Oxide, Metal, Poly
  • Stripping
  • Ion implant
  • Remote plasma cleans
  • Excellent oxygen, chlorine, and fluorine compatibility
  • Ultra-low particle generation
  • Excellent chemical and physical properties
  • Low out-gassing
Typical Physical Properties1
Physical Typical Value
Color White
Hardness, Shore A2 75
Tensile Strength, MPa 16.9
Elongation, % 400
100% Modulus, MPa 3.04
Compression Set4:
70 hours @ 200°C @ 25% Deflection
70 hours @ 120°C

Service Temperature Range -20°C~200°C
1 Accumulated Average data.
2 ASTM D2240 (AS 568A 214 O-ring test specimens)
3 ASTM D412 (Dumbbell test specimens)
4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application
Contact Detail
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