Product
Minimal Contamination in Plasma Process
Minimal Contamination in Plasma Process
 
Product ID: Puruz P310 perfluoroelastomer parts
Puruz P310 was developed for both static and low stress/low sealing force applications which emphasized excellent chemical compatibility and very low particle generation in oxygen and fluorine containing plasmas. The compound is developed specifically for select semiconductor plasma and gas deposition processes. Applications include: slit valve door, gas feed-through, chamber lid, etc. Puruz is able to function at temperatures up to 200°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P310.
Applications:
- Slit valve doors
- Gas inlet seals
- Window seals
- KF fitting seals
- Gas feed-through seals
- Chamber seals
- Isolator valve seals
- Lid seals
Recommended Processes
- Deposition: CVD, APCVD, HDPCVD..., PVD
- Plasma etching: Oxide, Metal, Poly
- Stripping
- Ion implant
- Remote plasma cleans
- Wet metal plating
Features:
- Excellent oxygen, chlorine, and fluorine compatibility
- Low particle generation
- Excellent chemical and physical properties
- Low out-gassing
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Contact Detail
Address: | No. 41, Wu-Chuan-Wu Road, New Taipei Industrial Park, New Taipei City 24888, Taiwan |
TEL: | +886-2-2298-8556 |
FAX: | +886-2-2299-2189 |
Email: | mfc@mfc.com.tw |
URL: | http://www.mfc.com.tw |
ZIP: | 24888 |