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Minimal Contamination in Plasma Process

Minimal Contamination in Plasma Process

Minimal Contamination in Plasma Process

Product ID: Puruz P310 perfluoroelastomer parts

Puruz P310 was developed for both static and low stress/low sealing force applications which emphasized excellent chemical compatibility and very low particle generation in oxygen and fluorine containing plasmas. The compound is developed specifically for select semiconductor plasma and gas deposition processes. Applications include: slit valve door, gas feed-through, chamber lid, etc. Puruz is able to function at temperatures up to 200°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P310.



  • Slit valve doors
  • Gas inlet seals
  • Window seals
  • KF fitting seals
  • Gas feed-through seals
  • Chamber seals
  • Isolator valve seals
  • Lid seals


Recommended Processes

  • Deposition: CVD, APCVD, HDPCVD..., PVD
  • Plasma etching: Oxide, Metal, Poly
  • Stripping
  • Ion implant
  • Remote plasma cleans
  • Wet metal plating


  • Excellent oxygen, chlorine, and fluorine compatibility
  • Low particle generation
  • Excellent chemical and physical properties
  • Low out-gassing
Typical Physical Properties1
Physical Typical Value
Color White
Hardness, Shore A2 76
Tensile Strength, MPa 16.7
Elongation, % 380
100% Modulus, MPa 3.01
Compression Set4:
70 hours @ 200°C @ 25% Deflection

Service Temperature Range -20°C~200°C
1 Accumulated Average data.
2 ASTM D2240 (AS 568A 214 O-ring test specimens)
3 ASTM D412 (Dumbbell test specimens)
4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application
Contact Detail
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