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Excellent High Temperature Resistance in Diffusion Process

Excellent High Temperature Resistance in Diffusion Process

For Harsher Plasma and Higher Sealing Loads

Product ID: Puruz P515

Puruz P515 is a specific compound with excellent mechanical properties. It has a low compression set for high temperature application use in o-rings, diaphragms, seals, and other components of the semiconductor and TFT-LCD industries. It has a good response to temperature cycling effects, remaining stable at service temperatures as high as 315°C. It is well-suited for both static and dynamic applications such as slit valve doors, gas feed-throughs, and chamber seals etc. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P515.



  • Valve seals
  • Bell jar seals
  • Chamber seals
  • Gas inlet seals
  • End point windows
  • Window seals
  • KF fitting seals (center rings)
  • V-seals
  • Filter seals
  • Lid seals
  • Isolator valve seals
  • Slit valve seals


Recommended Processes

  • Deposition: CVD, PVD
  • Plasma etching: Oxide, Metal, Poly
  • Ion implant
  • Diffusion
  • Rapid thermal process
  • Dry etching
  • Excellent plasma resistance
  • Excellent chemical resistance
  • Excellent physical properties
  • Low out-gassing
Typical Physical Properties1
Physical Typical Value
Color Black
Hardness, Shore A2 79
Tensile Strength, MPa 18.2
Elongation, % 250
100% Modulus, MPa 7.26
Compression Set4:
70 hours @ 200°C @ 25% Deflection

Service Temperature Range -20°C~315°C
1 Accumulated Average data.
2 ASTM D2240 (AS 568A 214 O-ring test specimens)
3 ASTM D412 (Dumbbell test specimens)
4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application
Contact Detail
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