Product
Minimal Contamination in Plasma Process
Product ID: Puruz P330 perfluoroelastomer parts
Puruz P330 is a compound specifically developed for deposition processes. It has also exhibited excellent etching and stripping process applications. This material provides excellent chemical compatibility and is available in an infinite geometries and cross sections. It has been specifically formulated for ultra-low particle generation in oxygen and fluorine containing plasmas and is well-suited for both static and dynamic applications, i.e., slit valve door, gas feed-through, chamber lid, etc. It remains stable at service temperatures as high as 230°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz P330.
Applications:
- Slit valve doors
- Gas inlet seals
- Window seals
- KF fitting seals
- Gas feed-through seals
- Chamber seals
- Isolator valve seals
- Lid seals
Recommended Processes
- Deposition: CVD, APCVD, HDPCVD..., PVD
- Plasma etching: Oxide, Metal, Poly
- Ashing
- Ion implant
- Remote plasma cleans
Features:
- Excellent oxygen, chlorine, and fluorine compatibility
- Minimal particle generation
- Excellent chemical and physical properties
- Unlimited design flexibility
- Low out-gassing
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Contact Detail
| Address: | No. 41, Wu-Chuan-Wu Road, New Taipei Industrial Park, New Taipei City, 24888, TAIWAN |
| TEL: | +886-2-2298-8670 |
| FAX: | +886-2-2299-2189 |
| Email: | mfc@mfc.com.tw |
| URL: | http://www.mfc.com.tw |
| ZIP: | 24888 |