Product

For Harsher Plasma and Higher Sealing Loads

For Harsher Plasma and Higher Sealing Loads

For Harsher Plasma and Higher Sealing Loads

Product ID: Puruz 9007

Puruz 9007 is a mineral filled compound which is designed for use in wide variety of semiconductor dry-etch processing applications where small amounts of contamination are acceptable. This product exhibits excellent performance in oxygen and fluorine-based plasmas. Puruz 9007 is formulated in high sealing load applications and remains stable at service temperatures as high as 230°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz 9007.

Applications:
  • Slit valve doors
  • Gas inlet seals
  • Window seals
  • KF fitting seals
  • Gas feed-through seals
  • Chamber seals
  • Isolator valve seals
  • Lid seals

Recommended Processes
  • Deposition: CVD, PECVD, HDPCVD...,PVD
  • Plasma etching: Oxide, Metal, Poly
  • Ashing
  • Ion implant
  • Remote plasma cleans
  • Rapid thermal process
 
Features:
  • Excellent plasma resistance
  • Excellent chemical resistance
  • Excellent physical properties
  • Low out-gassing
See more complete detail
Typical Physical Properties1
Physical Typical Value
Color White
Specific 2.47
Hardness, Shore A2 87
Mechanical3  
Tensile Strength, MPa 12.6
Elongation, % 118
100% Modulus, MPa 10.9
Compression Set4:
70 hours @ 200°C @ 25% Deflection, %

18
Thermal  
Service Temperature Range -20°C~230°C
1 Accumulated Average data.
2 ASTM D2240 (AS 568A 214 O-ring test specimens)
3 ASTM D412 (Dumbbell test specimens)
4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application
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