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9007
For Harsher Plasma and Higher Sealing Loads

Puruz 9007
Compound Description
Puruz 9007 is a mineral filled compound which is designed for use in wide variety of semiconductor dry-etch processing applications where small amounts of contamination are acceptable. This product exhibits excellent performance in oxygen and fluorine-based plasmas. Puruz 9007 is formulated in high sealing load applications and remains stable at service temperatures as high as 230°C. Class 100 post-cleaning and packaging is adapted for parts made from Puruz 9007.
Features
  • Excellent plasma resistance
  • Excellent chemical resistance
  • Excellent physical properties
  • Low out-gassing
    		•
    Applications
  • Slit valve doors
  • Gas inlet seals
  • Window seals
  • KF fitting seals
  • Gas feed-through seals
  • Chamber seals
  • Isolator valve seals
  • Lid seals
    		•
    Recommended Processes
  • Deposition: CVD, PECVD, HDPCVD...,PVD
  • Plasma etching: Oxide, Metal, Poly
  • Ashing
  • Ion implant
  • Remote plasma cleans
  • Rapid thermal process
    • Typical Physical Properties1
    Physical Typical Value
    Color White
    Specific 2.47
    Hardness, Shore A2 87
    Mechanical3  
    Tensile Strength, MPa 12.6
    Elongation, % 118
    100% Modulus, MPa 10.9
    Compression Set4:
    70 hours @ 200°C @ 25% Deflection, %
    18
    Thermal  
    Service Temperature Range -20°C~230°C
    1 Accumulated Average data.
    2 ASTM D2240 (AS 568A 214 O-ring test specimens)
    3 ASTM D412 (Dumbbell test specimens)
    4 ASTM D395B and ASTM D1414 (AS 568A 214 O-ring test specimens)
    Any suggestions made regarding material selections or part designs in this literature are offered as suggestions only based on our experience and understanding of standard application. It is the responsibility of the user to determine full compliance in their particular use. MFC offers no expressed or implied warranties concerning form, fit, or function of any product in any application